STAUF SPU-570
Polymer Adhesive for Solid Planks
Special features
- Very high shear strength
- No water or solvents
- Fast setting
PDF version
Technical Data Sheet (TDS)
| Product Description |
| STAUF SPU-570 is a polymer-based, high-strength adhesive for professional wood flooring installation. It is specially formulated for wide plank floors. SPU-570 has an extremely high shear strength to help control common cupping problems associated with wide-width solid flooring. SPU-570 spreads easily and has a non-slump formula to allow the ridges to bridge gaps between the wood floor and subfloor. Since there is no water or solvent present it will not cause dimensional changes to wood flooring. SPU-570 allows fast installation even with complicated patterns due to its strong green grab. There is no flash time required, so installation can commence immediately. Rolling is neither required nor recommended. It offers superior flexibility and is designed to keep the flooring in place, yet allow for normal movement during seasonal changes to the flooring. |
| Pre-Installation Checklist |
| A successful installation requires proper preparation of the subfloor. Read and understand all applicable guidelines and technical data sheets before installation. Follow industry standards and flooring manufacturers' recommendations for subfloor moisture content, design, layout, and application of flooring materials. All flooring material's backing must be solid, sound, and free of anti-adherents. All slab constructions must meet the specific requirements of the floor covering to be installed. |
| Sub Floor Examination |
| Prior to installation, the subfloor must be checked according to NWFA installation guidelines. It must be solid and sound, flat, permanently dry, clean, free of chaps, indentations, and anti-adherents, and resistant to pressure and tension. The moisture content of all floors must be measured before installation. |
| Moisture content in concrete subfloors must be below 3#/24hr/1,000SF using the Calcium Chloride Test or below 75% RH using an in-situ probe per ASTM F1869 and F2170. |
| All wood floors should have 6-9% moisture content at installation. There should be no more than a 4-5% variance in moisture content between the wood flooring and any wood subfloor. See NWFA guidelines and the wood flooring manufacturer's recommendations for details. |
| Sub Floor Preparation |
| Depending on the type and condition of the subfloor, a mechanical treatment (e.g. mechanical brushing, grinding, or sanding) may be required. The intensity of such work must be determined at the site by the installer. Dust, paint, residual adhesives, or other surface contaminants must be removed by suitable means. Cleaning the surface with an industrial vacuum cleaner is recommended. Cracks and gaps must be filled with concrete crack filler unless they are expansion joints. Level when necessary to 3/16 inches within 10 feet. Heated subfloors, gypcrete, wooden subfloors, levelers, patches, and lightweight concrete must be primed. Fast curing cementitious leveling or patching compounds might reduce the flash and work time of water-based products due to absorption. |
| Installation Procedure |
| Spread the adhesive with the appropriate notched trowel. Avoid excessive adhesive thickness by passing the trowel evenly through the adhesive at a 45° angle. There is no flash time, so installation should begin immediately. Lay the flooring into the adhesive, correctly position it and press down firmly. Rolling is neither required nor recommended. Be sure to check the boards at regular intervals to ensure a good adhesive transfer from subfloor to flooring is achieved. Bowed boards or boards over low spots should be weighted down until the adhesive cures. |
| Storage |
| Place plastic on top of unused adhesive. Remove air pockets between adhesive and plastic. Place silica bags in the pail. Place lid on pail and seal tightly. Store pail in a cool dry place. |
| Limitations |
| When using other than STAUF products in conjunction with STAUF primers, sealers, leveling compounds, or adhesives, STAUF denies any and all responsibility for any ensuing problems and/or damages without prior written authorization from STAUF. |
| Do not install solid wood below grade. Do not use on concrete with curing agents or sealers except approved STAUF Sealers. Do not use on damp subfloors. Do not install wood flooring with a moisture reading above 9%. Do not use adhesive as a leveling material. |
| This adhesive is mold and mildew-resistant and water resistant when fully cured. However, it will not prevent moisture-related damages to wood flooring unless it is used as a moisture barrier (if applicable) within the limitations set forth in the Technical Data Sheet. |
| In case of an accident, injury, spill, or exposure, see SDS for information. Consult the Technical Data Sheet at www.staufusa.com for updated information. |
| The foregoing representations are based on the results of our most current product and material testing within a controlled environment and are of a non-obligatory advisory nature only. As such, they do not constitute an express or implied warranty of any kind including the Warranty of Merchantability and/or Fitness for a Particular Purpose. Because we have no control over the actual quality of workmanship, materials used, and worksite conditions, STAUF USA LLC will in no event be liable for any incidental and/or consequential damages. Therefore, we strongly recommend that prior on-site testing be conducted to refer to and study the suitability of the product for the intended purpose. With the release of this Technical Information Sheet, all its prior versions become invalid. For warranty and warranty disclaimer information please see our Limited Lifetime Warranty @ www.staufusa.com |
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| Revision: 2022-10-10 10:29:22 | |||||||||||||||||||||||||||||||||||||||||||||||||
