PDF version
Technical Data Sheet (TDS)
IFK-100 Refill
Wood Flooring Repair Kit
Special features
- Fills voids under engineered or solid wood flooring
|
General Features |
- Contains no isocyanates
- Contains no water
- High shear strength
- Contains no chlorinated solvents
- Contains no solvents
- Contains no VOC (calc. per CA Rule 1168)
- Nonflammable
- High solids content
- Ozone friendly
- Special polymer will not etch floors finish
- Moisture cured for a strong bond
- Freeze/thaw stable
- Works under any STAUF adhesive
|
Installation Features |
- Bridges normal subfloor variations
- Eliminates hollow spots
- Very low odor
- Cleans with acetone
- Does not cause cupping of wood flooring
- Higher temp and RH will shorten drying time
- No risk of sensitization
|
Long Term Features |
- Resistant against aging
- Remains elastic
- Suitable for radiant heat systems
- Allows normal dimensional changes in wood flooring
- Adhesive is waterproof when cured
- Eliminates hollow spots
- No health hazards
|
|
Drying Time |
|
Temperature Range during Installation |
|
Relative Humidity Range during Installation |
|
Packing Size |
- 1 qt. Refill - 6 count case
- 1 gal. Refill - 6 count case
|
Density [lbs./gal.] |
|
Color |
|
Shelf Life |
- 6 Months in original, unopened container
|
|
Revision: 2015-10-06 12:40:36 |
|