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Technical Data Sheet (TDS)

IFK-100 Refill

Wood Flooring Repair Kit

Special features

  • Fills voids under engineered or solid wood flooring

General Features
  • Contains no isocyanates
  • Contains no water
  • High shear strength
  • Contains no chlorinated solvents
  • Contains no solvents
  • Contains no VOC (calc. per CA Rule 1168)
  • Nonflammable
  • High solids content
  • Ozone friendly
  • Special polymer will not etch floors finish
  • Moisture cured for a strong bond
  • Freeze/thaw stable
  • Works under any STAUF adhesive
Installation Features
  • Bridges normal subfloor variations
  • Eliminates hollow spots
  • Very low odor
  • Cleans with acetone
  • Does not cause cupping of wood flooring
  • Higher temp and RH will shorten drying time
  • No risk of sensitization
Long Term Features
  • Resistant against aging
  • Remains elastic
  • Suitable for radiant heat systems
  • Allows normal dimensional changes in wood flooring
  • Adhesive is waterproof when cured
  • Eliminates hollow spots
  • No health hazards
Drying Time
  • Approx. 12 hours
Temperature Range during Installation
  • 50-90F (10-32C)
Relative Humidity Range during Installation
  • 30% - 80%
Packing Size
  • 1 qt. Refill - 6 count case
  • 1 gal. Refill - 6 count case
Density [lbs./gal.]
  • 10.9
Color
  • Cream
Shelf Life
  • 6 Months in original, unopened container
Revision: 2015-10-06 12:40:36

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